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1,3-Hexafluorobutadiene-(C4F6)
Hexafluorobutadiene is a colorless and odorless gas under ambient temperature and pressure.
| Specifications | |
| Purity , % | 99.9 |
| Argon+Oxygen | ≤10 ppmv |
| Nitrogen | ≤40 ppmv |
| Carbon Dioxide | ≤20 ppmv |
| Carbon Monoxide | ≤7 ppmv |
| Other Halocarbons | ≤700 ppmv |
| Hydrogen Fluoride | ≤10 ppmv |
| Ship | |
| DOT Shipping Name | Liquefied gas, toxic, flammable,n.o.s.(HEXAFLUORO-1,3- BUTADIENE) |
| DOT Classification | 2.1 , 2.3 |
| DOT Label | Liquefied gas, toxic, flammable |
| UN Number | UN 3160 |
| CAS No. | 685-63-21 |
| CGA/DISS | 638 |
| Shipped as | Liquefied gas |
| Technical Information | |
| Cylinder State @ 21.1°C | Liquid |
| Flammable Limits In Air | |
| Auto Ignition Temperature (°C ) | |
| Molecular Weight (g/mol) | 162.03 |
| Specific gravity (air =1) | |
| Critical Temperature ( °C ) | 139.6 |
| Critical Pressure ( psig ) | |
| Applications | |
| This is a next gereration core material required to minimize circuit line widths and depths in LSI production processes . This dry etching gas is used to micro contact hole etching processes . For any specialty gas based on a CxFy Formula , the less the fraction F/C becomes, the more CF2 radicals are generated . As the fraction is lower for C4F6 than for C2F6 and C3F8 , more CF2 radicals are generated , which , in turn, etches oxide films . Therefore , C4F6 has a higher selectivity for oxide films and allows for more even etching . | |