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Disilane - ( SI2H6 )
Disilane is noncorrosive, colorless, gas which is spontaneously flammable in air. It decomposes slowly at room temperature to monosilane and hydrogen. It is compatible with hydrogen, argon, helium, and nitrogen, and is often shipped as a mixture with these gases, as well as in pure form.
| Specifications | |
| Purity | 99.998 |
| Oxygen + Argon | ≤1 ppmv |
| Nitrogen | ≤1 ppmv |
| Carbon Monoxde | ≤1 ppmv |
| Carbon Dioxide | ≤1 ppmv |
| THC as CH4 | ≤1 ppmv |
| TCS ( Total Chlorosilanes ) | ≤ 0.2 ppmv |
| Higher silane | ≤ 50 ppmv |
| Silane | ≤ 200 ppmv |
| Water | ≤ 1 ppmv |
| Ship | |
| DOT Shipping Name | Compressed Gas Flammable, NOS ( Disilane ) |
| DOT Classification | 2.1 ( Flammable Gas ) |
| DOT Label | Flammable Gas |
| UN Number | UN 1954 |
| CAS No. | 1590-87-0 |
| CGA/DISS/JIS | 350/632/W22-14L |
| Shipped as | LiquefiedGas |
| Technical Information | |
| Cylinder State @ 21.1°C | Liquid |
| Flammable Limits In Air | 2-98% |
| Auto Ignition Temperature (°C ) | -100 |
| Molecular Weight (g/mol) | 62.22 |
| Specific gravity (air =1) | 2.1 |
| Critical Temperature ( °C ) | 150.85 |
| Critical Pressure ( psig ) | 747 |
| Applications | |
| .Mainly used for miniaturization semiconductors manufacturing process in the high spedd and low temperature deposition of uniform thin films . .The core applicitons such as process below 20nm node IC semiconductors , advanced memory chips ( DRAM/NAND Flash ), also used in gas mixture for HIT solar cells , LTPS TFT/LCD display panels , and LED . | |